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Magnetron sputtering (磁控濺射台))

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磁控濺射的工作原理是什麽?What is the working principle of magnetron sputtering?

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磁控濺射的工作原理是什麽?What is the working principle of magnetron sputtering?

發布日期:2019-01-05 作者:www.tonertimes.com 點擊:

磁控濺射的工作原理是指電子在電場E的作用下,在飛向基片過程中與氬原子發生碰撞,使其電離產生出Ar正離子和新的電子;新電子飛向基片,Ar離子在電場作用下加速飛向陰極靶,並以高能量轟擊靶表麵,使靶材發生濺射。在濺射粒子中,中性的靶原子或分子沉積在基片上形成薄膜,而產生的二次電子會受到電場和磁場作用,產生E(電場)×B(磁場)所指的方向漂移,簡稱E×B漂移,其運動軌跡近似於一條擺線。


若為環形磁場,則電子就以近似擺線形式在靶表麵做圓周運動,它們的運動路徑不僅很長,而且被束縛在靠近靶表麵的等離子體區域內,並且在該區域中電離出大量的Ar 來轟擊靶材,從而實現了高的沉積速率。隨著碰撞次數的增加,二次電子的能量消耗殆盡,逐漸遠離靶表麵,並在電場E的作用下Z終沉積在基片上。由於該電子的能量很低,傳遞給基片的能量很小,致使基片溫升較低。


磁控濺射台是入射粒子和靶的碰撞過程。入射粒子在靶中經曆複雜的散射過程,和靶原子碰撞,把部分動量傳給靶原子,此靶原子又和其他靶原子碰撞,形成級聯過程。在這種級聯過程中某些表麵附近的靶原子獲得向外運動的足夠動量,離開靶被濺射出來。

     The working principle of magnetron sputtering is that electrons collide with argon atoms in the process of flying to the substrate under the action of electric field E, resulting in AR positive ions and new electrons; new electrons fly to the substrate, and Ar+ ions accelerate to the cathode target under the action of electric field, and bombard the target surface with high energy, resulting in sputtering of the target. In sputtered particles, the neutral target atoms or molecules are deposited on the substrate to form a thin film, and the secondary electrons generated will be affected by the electric field and magnetic field, resulting in the direction drift of E (electric field) × B (magnetic field), which is called e × B drift for short, and its motion track is similar to a cycloid.  

      If the magnetic field is circular, the electrons move in the form of approximate cycloid on the target surface. Their motion path is not only very long, but also bound in the plasma region near the target surface. In this region, a lot of AR is ionized to bombard the target, thus achieving a high deposition rate. With the increase of the number of collisions, the energy of the secondary electrons is exhausted and gradually away from the target surface, and finally deposited on the substrate under the action of the electric field E. Because the energy of the electron is very low and the energy transferred to the substrate is very small, the substrate temperature rise is low.

Magnetron sputtering is a collision process between the incident particles and the target. The incident particle experiences a complex scattering process in the target, collides with the target atom, and transfers part of the momentum to the target atom, which collides with other target atoms, forming a cascade process. In this kind of cascade process, some target atoms near the surface obtain enough momentum to move outwards, leaving the target to be sputtered out.




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