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Chinas plasma etching machine has reached the advanced level in the world中國等離子體刻蝕機達到世界先進水平

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Chinas plasma etching machine has reached the advanced level in the world中國等離子體刻蝕機達到世界先進水平

發布日期:2018-07-07 作者:cycas.testxy.com 點擊:

日前,央視財經頻道播出的《感受中國製造》第五集《中國“芯”力量》介紹了中國在半導體設備和半導體原材料上取得的成績和進步。其中,Z引人矚目的莫過於中國企業在刻蝕機上取得的成績——16nm刻蝕機實現商業化量產並在客戶的生產線上運行,7-10nm等離子刻蝕機設備可以與世界Z前沿技術比肩。

相對於中國在光刻機上與ASML的巨大差距,在刻蝕機上國內企業不僅可以滿足本國企業的需求,還能夠進入國際市場上與應用材料、科林等國際巨頭一爭長短。而這背後,是一群科技人才放棄美國優越的待遇選擇回國,並耗費十多年時間持之以恒的付出和努力換來的成績。

十年磨一劍技術比肩國際巨頭

本次Z讓人振奮的,就是在中國Z薄弱的半導體設備方麵取得了令人欣喜的成績——中微半導體的16nm刻蝕機實現商業化量產並在客戶的生產線上運行,7-10nm刻蝕機設備可以與世界Z前沿技術比肩。

刻蝕機是芯片生產製造的重要設備,不少網友會將光刻機和刻蝕機搞混,有的網友甚至將國內實現16nm刻蝕機量產的新聞誤讀為實現16nm光刻機量產。

等離子刻蝕機

其實光刻機和刻蝕機是兩種設備,光刻機的工作原理是用激光將掩膜版上的電路結構臨時複製到矽片上。而刻蝕機是按光刻機刻出的電路結構,在矽片上進行微觀雕刻,刻出溝槽或接觸孔的設備。

等離子體刻蝕機對加工精度的要求非常高,加工精度是頭發絲直徑的幾千分之一到上萬分之一。以16nm的CPU來說,等離子體刻蝕的加工尺度為普通人頭發絲的五千分之一,加工的精度和重複性要達到五萬分之一。

       Recently, the fifth episode "China's core power" of "feeling made in China" broadcast by CCTV financial channel introduced China's achievements and progress in semiconductor equipment and semiconductor raw materials. Among them, the most remarkable achievement of Chinese enterprises in the etching machine is that the 16nm etching machine realizes commercial mass production and runs on the customer's production line. The 7-10nm plasma etching machine equipment can be compared with the most advanced technology in the world. 

      Compared with the huge gap between China and ASML in lithography machine, domestic enterprises in lithography machine can not only meet the needs of domestic enterprises, but also enter the international market to compete with application materials, Colin and other international giants. Behind this, a group of scientific and technological talents chose to return home after giving up the superior treatment of the United States, and spent more than ten years of unremitting efforts and efforts in exchange for achievements.

    One of the most exciting achievements of the international giants in the past decade is that they have made gratifying achievements in China's weakest semiconductor equipment. 

     The 16 nm etching machine of medium and micro semiconductors has realized commercial mass production and operated on the production line of customers. The 7-10 nm etching machine equipment can be compared with the most cutting-edge technology in the world. 

    Etching machine is an important equipment for chip production and manufacturing. Many netizens will confuse the lithography machine with the etching machine. Some netizens even misread the news of realizing the production of 16nm etching machine in China as realizing the production of 16nm lithography machine. 

    In fact, the lithography machine and the etching machine are two kinds of equipment. The working principle of the lithography machine is to use the laser to temporarily copy the circuit structure on the mask onto the silicon wafer. The etching machine is a kind of equipment which carves the micro - groove or contact hole on the silicon wafer according to the circuit structure carved by the lithography machine. 

    The requirements of plasma etching machine for machining accuracy are very high. The machining accuracy is one thousandth to one thousandth of the hair diameter. For a 16 nm CPU, the processing scale of plasma etching is one fifth of that of ordinary human hair, and the processing accuracy and repeatability should reach one fifth of that of ordinary human hair.

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相關標簽:等離子刻蝕機

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