Name: Suzhou cycas Microelectronics Co., Ltd.
Address: 1st floor,B06 building,No.2,Fuxing Road,Zhangjiagang Economic Development Zone,Jiangsu Province 215600PRC
Recently, the fifth episode "China's core power" of "feeling made in China" broadcast by CCTV financial channel introduced China's achievements and progress in semiconductor equipment and semiconductor raw materials. Among them, the most remarkable achievement of Chinese enterprises in the etching machine is that the 16nm etching machine realizes commercial mass production and runs on the customer's production line. The 7-10nm plasma etching machine equipment can be compared with the most advanced technology in the world.
Compared with the huge gap between China and ASML in lithography machine, domestic enterprises in lithography machine can not only meet the needs of domestic enterprises, but also enter the international market to compete with application materials, Colin and other international giants. Behind this, a group of scientific and technological talents chose to return home after giving up the superior treatment of the United States, and spent more than ten years of unremitting efforts and efforts in exchange for achievements.
One of the most exciting achievements of the international giants in the past decade is that they have made gratifying achievements in China's weakest semiconductor equipment.
The 16 nm etching machine of medium and micro semiconductors has realized commercial mass production and operated on the production line of customers. The 7-10 nm etching machine equipment can be compared with the most cutting-edge technology in the world.
Etching machine is an important equipment for chip production and manufacturing. Many netizens will confuse the lithography machine with the etching machine. Some netizens even misread the news of realizing the production of 16nm etching machine in China as realizing the production of 16nm lithography machine.
In fact, the lithography machine and the etching machine are two kinds of equipment. The working principle of the lithography machine is to use the laser to temporarily copy the circuit structure on the mask onto the silicon wafer. The etching machine is a kind of equipment which carves the micro - groove or contact hole on the silicon wafer according to the circuit structure carved by the lithography machine.
The requirements of plasma etching machine for machining accuracy are very high. The machining accuracy is one thousandth to one thousandth of the hair diameter. For a 16 nm CPU, the processing scale of plasma etching is one fifth of that of ordinary human hair, and the processing accuracy and repeatability should reach one fifth of that of ordinary human hair.