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  The application of plasma etcher in PCB industry等離子刻蝕機在PCB線路板行業去膠渣製程的應用

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  The application of plasma etcher in PCB industry等離子刻蝕機在PCB線路板行業去膠渣製程的應用

發布日期:2018-09-15 作者:www.tonertimes.com 點擊:

等離子刻蝕機在PCB線路板行業去膠渣製程的應用

 等離子體又叫做電漿,是由有些電子被掠奪後的原子及原子被電離後發生的正負電子構成的離子化氣體狀物質,也有稱其為物質的第四相態。等離子體相態是因為原子中激化的電子和分子無序運動的狀況,所以具有適當高的能量。  

 (1)PCB多層板等離子刻蝕機-機理:  

 在真空室內部的氣體分子裏施加能量(如電能),由加快電子的抵觸,使分子、原子的Z外層電子被激化,並生成離子,或反響性高的自由基。  

 如此發生之離子、自由基被接連的抵觸和受電場效果力而加快,使之與資料外表碰撞,並損壞數微米規模以內的分子鍵,誘導減少一定厚度,生成高低外表,同時構成氣體成分的官能團等外表的物理、化學變化,進步鍍銅粘結力、除汙等抄板效果。 等離子刻蝕機用氣體多見的有氧氣、氮氣和四氟化碳氣。下麵經過由氧氣和四氟化碳氣所構成之混合氣體,舉例說明等離子體處理之機理:  V15

等離子刻蝕機

 (2)PCB多層板等離子刻蝕機-用處:  

 1、凹蝕 / 去孔壁樹脂沾汙;  

 2、進步外表潮濕性(聚四氟乙烯外表活化處理);  

 3、選用激光鑽孔之盲孔內碳的處理;  

 4、改動內層外表形狀和潮濕性,進步層間結合力;  

 5、去除抗蝕劑和阻焊膜殘留。  

 (3)PCB多層板等離子體處理-舉例:  

 A.純聚四氟乙烯資料的活化處理  

 關於純聚四氟乙烯資料的活化處理,是選用單步活化通孔技術。所用氣體絕大有些是氫氣和氮氣的組合。  

 待處理PCB板無需加熱,因為聚四氟乙烯被處理成活性,潮濕性有所增加。真空室一旦到達操作壓力,啟用工作氣體和射頻電源。  

 大多數純聚四氟乙烯抄板的處理僅需約20分鍾。但是,因為聚四氟乙烯資料的恢複功能(回複到不潮濕外表狀況),化學沉銅之孔金屬化處理需在經等離子體處理後的48小時內完結。  

 B.含填料聚四氟乙烯資料的活化處理  

 關於含填料的聚四氟乙烯資料製作的印製電路板(如不規矩的玻璃微纖維、玻璃織造增強和陶瓷填充之聚四氟乙烯複合物),需兩步處理。  

 第一步,清洗和微蝕填料。該步典型之操作氣體為四氟化碳氣、氧氣和氮氣。

 第二步,等同於前述純聚四氟乙烯資料外表活化處理所選用的一步法抄板技術。

    The application of plasma etcher in PCB industry

    Plasma, also known as plasma, is an ionized gaseous substance composed of the atoms after some electrons are plundered and the positive and negative electrons after the atoms are ionized. It is also known as the fourth phase state of matter. The plasma phase state is due to the disordered motion of the excited electrons and molecules in the atom, so it has a proper high energy. 

(1) PCB multi-layer plasma etching machine mechanism: 

    Apply energy (such as electric energy) to the gas molecules inside the vacuum chamber to accelerate the collision of electrons, so that the outermost electrons of molecules and atoms are excited, and generate ions, or highly reactive free radicals. 

   The resulting ions and free radicals are continuously conflicted and accelerated by the electric field effect force, making them collide with the surface of the data, damaging the molecular bonds within the scale of several microns, inducing the reduction of certain thickness, generating high and low surface, and the physical and chemical changes of the surface of the functional groups that make up the gas composition, so as to improve the adhesion of copper plating, decontamination and other copy board effects. Oxygen, nitrogen and carbon tetrafluoride are the most common gases used in plasma etching. The following is a mixture of oxygen and carbon tetrafluoride gas to illustrate the mechanism of plasma treatment: V15 

(2) PCB multi-layer plasma etching machine - use: 

  1. Pitting / pore wall resin contamination;

  2. Improvement of surface wettability surface activation treatment of polytetrafluoroethylene);

  3. Treatment of carbon in blind hole with laser drilling;

  4. Change the shape and humidity of the inner surface, improve the adhesion between layers;

  5. Remove the corrosion inhibitor and solder mask residue.

    (3) PCB multi-layer plate plasma processing - example:

    A. activation processing of pure polytetrafluoroethylene data activation processing of pure polytetrafluoroethylene data, single-step activation through-hole technology is selected.

    Most of the gases used are a combination of hydrogen and nitrogen.

    The PCB to be treated does not need to be heated, because the polytetrafluoroethylene is treated to be active and the wettability is increased. Once the vacuum chamber reaches the operating pressure, enable the working gas and RF power supply. Most pure polytetrafluoroethylene boards only need about 20 minutes to process.

      However, due to the recovery function of polytetrafluoroethylene data (returning to the non humid appearance), the hole                metallization of chemical copper deposition needs to be completed within 48 hours after plasma treatment. 

    B. Activation treatment of polytetrafluoroethylene 

        With fillers PCB made of polytetrafluoroethylene with fillers (such as irregular glass microfiber, glass weaving reinforcement              and polytetrafluoroethylene composite filled with ceramics) needs two-step treatment. 

        The first step is to clean and micro etch the packing. The typical operation gases in this step are carbon tetrafluoride, oxygen            and nitrogen. 

       The second step is equivalent to the one-step plate making technology selected for the surface activation treatment of the               pure polytetrafluoroethylene data.

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