等離子去膠機主要用於哪些方麵？What are the main uses of plasma degumming machine?

幹法去膠機工藝是微加工實驗中一個非常重要的過程。在電子束曝光、紫外曝光等微納米加工工藝之後，都需要對光刻膠進行去除或打底膜處理。光刻膠去除的是否幹淨徹底、對樣片是否有損傷等問題將直接影響到後續工藝的順利完成。

等離子去膠機主要用於光刻膠的剝離或灰化，也可用於：

1. 有機及無機殘留物的去除

2. 去除殘膠以及等離子刻蝕的應用

3. 清洗微電子元件、電路板上的鑽孔或銅線框架

4. 提高黏附性，消除鍵合問題

5. 塑料的表麵改性：O2處理以改進塗覆性能

6. 產生親水或疏水表麵等

The technology of dry degumming machine is a very important process in the experiment of micromachining. After electron beam exposure and UV exposure, photoresist needs to be removed or treated with backing film. Whether the photoresist is completely removed and whether the sample is damaged will directly affect the successful completion of the subsequent process. 

Plasma degumming machine is mainly used for stripping or ashing photoresist, and can also be used for: 

1. Removal of organic and inorganic residues; 

2. Removal of residual glue and application of plasma etching; 

3. Cleaning of holes or copper wire frames on microelectronic components and circuit boards; 

4. Improving adhesion and eliminating bonding problems; 

5. Surface modification of Plastics: O2 treatment to improve coating performance; 

6. Generating hydrophilic or hydrophobic surfaces, etc