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反應離子刻蝕機檢驗操作及判斷Inspection operation and judgment of reactive ion etching machine

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反應離子刻蝕機檢驗操作及判斷Inspection operation and judgment of reactive ion etching machine

發布日期:2018-01-04 作者:www.tonertimes.com 點擊:

      反應離子刻蝕機是一款獨立式RIE反應離子刻蝕係統,配套有淋浴頭氣體分布裝置以及水冷RF樣品。具有不鏽鋼櫃子以及13"的上蓋式圓柱形鋁腔,便於晶圓片裝載.腔體有兩個端口:一個帶有2"的視窗,另一個空置用於診斷。反應離子刻蝕機可以支持Z大到12"的晶圓片。腔體為超淨設計,並且根據配套的真空泵可以達到10-6 Torr 或更小的極限真空。反應離子刻蝕機係統可以在20mTorr到8Torr之間的真空下工作。真空泵組包含一個節流閥,一個250l/s的渦輪分子泵,濾網過濾器,以及一個10cfm的機械泵(帶Formblin泵油)。RF射頻功率通過600W,13.56MHz的電源和自動調諧器提供。係統將持續監控直流自偏壓,該自偏壓可以高達-500V,這對於各向異性的刻蝕至關重要。

等離子刻蝕機

    反應等離子刻蝕機是基於PC控製的全自動係統。係統真空壓力及DC直流偏壓將以圖形格式實時顯示,流量及功率則以數字形式實時顯示。係統提供密碼保護的四級訪問功能:操作員級、工程師級、工藝人員級,以及維護人員級。允許半自動模式(工程師模式)、寫程序模式(工藝模式),和全自動執行程序模式(操作模式)運行係統。基於全自動的控製,該係統具有高度的可重複性。

    

反應離子刻蝕機檢驗操作及判斷

    1. 確認萬用表工作正常,量程置於200mV。

    2.冷探針連接電壓表的正電極,熱探針與電壓表的負極相連。

    3.用冷、熱探針接觸矽片一個邊沿不相連的兩個點,電壓表顯示這兩點間的電壓為正值,說明導電類型為P 型,刻蝕合格。相同的方法檢測另外三個邊沿的導電類型是否為P型。

    4.如果經過檢驗,任何一個邊沿沒有刻蝕合格,則這一批矽片需要重新裝片,進行刻蝕。

主營導航:熱真空係統,光學元件鍍膜機,單片晶圓清洗機,進口微波去膠機,進口雙模式刻蝕機

    Reactive ion etcher is an independent RIE reactive ion etching system, which is equipped with shower head gas distribution device and water-cooled RF sample. It has a stainless steel cabinet and a 13 "top cover cylindrical aluminum cavity for wafer loading. The cavity has two ports: one with a 2" window and the other empty for diagnosis. Reactive ion etchers can support up to 12 "wafer sizes. The cavity is of super clean design, and the limit vacuum of 10-6 torr or less can be achieved according to the matching vacuum pump. The reactive ion etching system can work in a vacuum between 20 and 8 Torr. The vacuum pump set consists of a throttle valve, a 250L / s turbo molecular pump, a strainer filter, and a 10cfm mechanical pump (with formblin pump oil). RF RF power is provided by 600W, 13.56MHz power supply and auto tuner. The system will continuously monitor the DC self bias voltage, which can be as high as - 500V, which is very important for anisotropic etching. 

   Reactive plasma etching machine is a fully automatic system based on PC control. The vacuum pressure and DC bias of the system will be displayed in graphic format in real time, and the flow and power will be displayed in digital format in real time. The system provides four level access functions of password protection: operator level, engineer level, process personnel level, and maintenance personnel level. Allow semi-automatic mode (Engineer mode), write program mode (process mode), and fully automatic execution program mode (operation mode) to run the system. Based on the fully automatic control, the system has a high degree of repeatability. 

Check operation and judgment of reactive ion etching machine 

  1. Confirm that the multimeter works normally and the range is set at 200mV.

  2. The cold probe is connected to the positive electrode of the voltmeter, and the hot probe is connected to the negative electrode of the voltmeter.

  3. Use cold and hot probes to contact two points on one edge of the silicon wafer that are not connected. The voltmeter shows that the voltage between the two points is positive, indicating that the conductive type is p-type, and the etching is qualified. The same method is used to detect whether the conductive type of the other three edges is p-type.

  4. If any edge is not etched as qualified after inspection, this batch of silicon wafers need to be reloaded for etching. Main navigation: thermal vacuum system, optical element coating machine, single wafer cleaning machine, imported microwave degumming machine, imported dual-mode etching machine


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