等離子刻蝕機的應用Application of plasma etcher

等離子體處理可應用於所有的基材，甚至複雜的幾何構形都可以進行等離子體活化、等離子體清洗，等離子體鍍膜也毫無問題。等離子體處理時的熱負荷及機械負荷都很低，因此，低壓等離子體也能處理敏感性材料。等離子刻蝕機的典型應用包括：

等離子體清除浮渣

光阻材料剝離

表麵處理

各向異性和各向同性失效分析應用材料改性

包裝清洗

鈍化層蝕刻

聚亞酰胺蝕刻

增強粘接力

生物醫學應用

聚合反應

混合物清洗

預結合清洗

Plasma treatment can be applied to all substrates, even complex geometry can be plasma activated, plasma cleaning, plasma coating is no problem. The heat load and mechanical load of plasma treatment are very low, so low pressure plasma can also treat sensitive materials. Typical applications of plasma etchers include:

Removal of scum by plasma

Photoresist stripping

surface treatment

Anisotropic and isotropic failure analysis using material modification

Packaging cleaning

Passivation layer etching

Polyimide etching

Enhance adhesion

Biomedical applications

Polymerization

Mixture cleaning

Pre combined cleaning