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等離子刻蝕機的缺點?Disadvantages of plasma etcher?

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等離子刻蝕機的缺點?Disadvantages of plasma etcher?

發布日期:2018-04-28 作者:www.tonertimes.com 點擊:

1、 矽片水平運行,機片高(等離子刻蝕去PSG槽式浸泡甩幹,矽片受衝擊小);

2、下料吸筆易汙染矽片(等離子刻蝕去PSG後甩幹);

3、傳動滾抽易變形(PVDF,PP材質且水平放置易變形);

4、成本高(化學品刻蝕代替等離子刻蝕成本增加)。

等離子刻蝕機

此外,有些等離子刻蝕機,如SCE等離子刻蝕機還具備“綠色”優勢:無氟氯化碳和汙水、操作和環境安全、排除有毒和腐蝕性的液體。SCE等離子刻蝕機支持以下四種平麵等離子體處理模式:

直接模式——基片可以直接放置在電極托架或是底座托架上,以獲得Z大的平麵刻蝕效果。

各向同性刻蝕與非各向同性刻蝕

各向同性刻蝕與非各向同性刻蝕(3張)

定向模式——需要非等向性刻蝕(anisotropic etching)的基片可以放置在特製的平麵托架上。

下遊模式——基片可以放置在不帶電托架上,以便取得微小的等離子體效果。

定製模式——當平麵刻蝕配置不過理想時,特製的電極配置可以提供。

   1.The silicon wafer runs horizontally, and the machine chip is high (plasma etching to PSG bath soaking and drying, and the silicon wafer is subject to small impact);

   2.The cutting suction pen is easy to contaminate the silicon wafer (plasma etching to PSG and then drying);

   3. The transmission roll extraction is easy to deform (PVDF, PP material and horizontally placed is easy to deform);

   4. The cost is high (the cost of chemical etching to replace plasma etching increases). 

      In addition, some plasma etchers, such as SCE plasma etchers, also have "green" advantages: no CFC and sewage, safe operation and environment, toxic and corrosive liquids are eliminated. The SCE plasma etcher supports the following four plane plasma processing modes: 

 Direct mode - the substrate can be directly placed on the electrode bracket or the base bracket to obtain the maximum plane etching effect. Isotropic etching and non-isotropic etching isotropic etching and non-isotropic etching (3 pieces) 

 Orientation mode - the substrate that requires non isotropic etching can be placed on a special plane bracket. 

 Downstream mode - the substrate can be placed on an uncharged bracket to achieve a small plasma effect. 

 Custom mode - when the planar etching configuration is not ideal, a special electrode configuration can be provided.


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相關標簽:等離子刻蝕機

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