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CCTV: Chinas micro and medium enterprises officially announced to master the 5nm etching machine technology!央視 : 中國中微正式宣布掌握5nm刻蝕機技術!

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CCTV: Chinas micro and medium enterprises officially announced to master the 5nm etching machine technology!央視 : 中國中微正式宣布掌握5nm刻蝕機技術!

發布日期:2018-06-02 作者:www.tonertimes.com 點擊:

不久前,央視報道了這樣的一則消息,中微半導體設備公司將在今年年底正式敲定5nm刻蝕機!而剛剛發布的蘋果A11芯片以及華為的麒麟970均是使用10nm工藝。

當所有的巨頭還在為10nm,7nm技術大肆進軍的時候,中國中微正式宣布掌握5nm技術,讓對手措手不及,難以置信!原來一直在這一領域沒有任何話語權的中國內地半導體企業能夠彎道超車!

而在中微這個隱形的巨人背後,如今已年過七旬的尹誌堯就是那個點燃星火的人。

在美國矽穀從事半導體行業20多年的尹誌堯,曾任AppliedMaterials應用材料公司的副總裁。91年,尹誌堯來到應用材料公司,負責同一領域的研究開發工作,先後獲得了60多個美國和國外的專利。尹誌堯開發或參與開發的產品,現在在這個領域大概占了全世界的50%。另外,還幫助成立了矽穀中國工程師協會,並擔任了頭兩任的主席。被譽為矽穀Z有成就的華人之一。

13年前(2004年),當時已經60歲的尹誌堯放棄了美國的百萬年薪,帶領三十多人的團隊,衝破美國政府的層層審查(所有人都承諾不把美國的技術帶回中國,包括所有工藝配方、設計圖紙,一切從零開始),回國創辦了中微半導體(以下簡稱中微),他要在芯片製造設備領域與國際巨頭直接競爭,取得一席之地。

尹誌堯帶著30多人的團隊回到中國,隻因為一句話:「學成隻為他日歸來,報效祖國」。

一切從零開始,憑著過去20多年的經驗和基礎技術支持,尹誌堯和他的團隊很快就開發出了第一台國產的生產半導體芯片的設備--等離子體刻蝕機

等離子體刻蝕機是在芯片上進行微觀雕刻,刻出又細又深的接觸孔或者線條,每個線條和深孔的加工精度是頭發絲直徑的幾千分之一到上萬分之一。

"在米粒上刻字的微雕技藝上,一般能刻200個字已經是極限,而91guochan的等離子刻蝕機在芯片上的加工工藝,相當於可以在米粒上刻10億個字的水平。"尹誌堯這樣形容到。

一個16nm的微觀邏輯器件有60多層微觀結構,要經過1000多個工藝步驟,要攻克上萬個技術細節才能加工出來。隻看等離子體刻蝕這個關鍵步驟,它的加工尺度為普通人頭發絲的五千分之一,加工的精度和重複性要達到五萬分之一。

等離子刻蝕機

中微在剛剛涉足IC芯片介質刻蝕設備時,就推出了65nm等離子介質刻蝕機產品,隨著技術的進步一直做到45nm、32nm、28nm等,現在16nm的蝕機產品已經在客戶的生產線上運行了。

據了解,在過去9個多月時間裏,中微的反應台交付量已突破400台;單反應台等離子體刻蝕設備已交付韓國領先的存儲器製造商;雙反應台介質刻蝕除膠一體機研製成功,這是業界首次將雙反應台介質等離子體刻蝕和光刻膠除膠反應腔整合在同一個平台上。

或許正是由於中微在半導體設備領域的突飛猛進,也引來了兩家國外競爭對手挑起的知識產權訴訟。不過,憑借過硬的自主技術專利,中微接連獲得的勝利。

2008年前後,正當中微公司自行開發12英寸芯片刻蝕機,準備進入國際一流芯片生產線時,兩家國際巨頭芯片設備公司找上門來。

2007年中微在美國被行業巨頭應用材料公司起訴侵權,但卻始終舉證無力,中微則抓住機會適時反訴對方不正當競爭,應用材料公司顯然對這一情況準備不足,Z終不得不撤訴求和。

2009年另一巨頭美國科林研發又在台灣起訴中微侵犯其發明專利,由於中微半導體在前期已作了大量的知識產權預警分析和準備工作,所以,僅用不到一個月時間,公司就決定"以攻為守",向法院提交了大量證據,采用"釜底抽薪"的做法,主張科林公司兩項專利無效。同時,企業還向台灣智慧財產局主張科林公司的專利無效。

2009年9月8日,台灣智慧財產法院一審判決科林公司專利無效。中微半導體很快接到了台積電的訂單。此後,中微半導體又在科林公司上訴的二審中獲勝。在台灣智慧財產局的交鋒中,中微半導體以充足的證據,使得科林公司的聚焦環配置專利於2011年被宣布無效,密封環專利也被宣布無效,掃除了產品進入台灣市場的知識產權障礙。

如今,中微正在開發5納米芯片製造設備意欲打破德美壟斷。這個技術要求芯片上的均勻度達到0.5納米,相當於原子水平。目前世界上投入Z先進的芯片是10納米,而中國能夠量產Z新的芯片還在40納米和28納米,和國際Z尖端的水平還差3代。在這個高度競爭的行業,誰能夠在技術上領先,誰就能占領市場。

Z先進的像英特爾、台積電、三星它們的14納米已經成熟生產了,10納米隨著蘋果A11和華為麒麟970芯片的上市,台積電率先進入到成熟量產期。

今年4月,尹誌堯的中微半導體公司宣布,已經掌握5納米技術,預計年底正式敲定5納米刻蝕機。無獨有偶,兩周後,IBM也宣布掌握5納米技術。因此,尹誌堯這一宣布,意味著中微在核心技術上突破了外企壟斷,中國半導體技術第一次占領至高點。

       Not long ago, CCTV reported that China micro Semiconductor Equipment Co., Ltd. will officially finalize the 5nm etcher by the end of this year! The just released Apple a11 chip and Huawei's Kirin 970 are all using the 10nm process. 

      When all the giants are still marching for 10nm and 7Nm technologies, China ' 。 

       Yin Zhiyao, who has been engaged in semiconductor industry in Silicon Valley for more than 20 years, was the vice president of applied materials. In 1991, Yin Zhiyao came to the applied materials company to take charge of the research and development work in the same field, and successively obtained more than 60 US and foreign patents. The products that Yin Zhiyao developed or participated in now account for about 50% of the world's products in this field. In addition, he helped to establish the Silicon Valley China Engineers Association and served as the first two presidents. Known as one of the most successful Chinese in Silicon Valley.          13 years ago (in 2004), Yin Zhiyao, who was 60 years old at that time, gave up his million year salary in the United States, led a team of more than 30 people, broke through the level by level review of the U.S. government (everyone promised not to bring American technology back to China, including all process formulas, design drawings, all from scratch), returned to China and founded China micro semiconductor (hereinafter referred to as China micro), he wanted to lead in chip manufacturing equipment Domain competes directly with international giants to gain a place. 

      Yin Zhiyao returned to China with a team of more than 30 people because of one sentence: "learning is only for the return of the motherland in the future.". 

      From scratch, with over 20 years of experience and basic technical support, Yin Zhiyao and his team soon developed the first domestic device for semiconductor chip production plasma etcher. 

     The plasma etching machine is used to carve the contact holes or lines on the chip. The processing accuracy of each line and deep hole is one thousandth to one thousandth of the hair diameter. 

   "In the microcarving technology of lettering on rice grains, it's the limit to be able to carve 200 characters. The processing technology of our plasma etching machine on chip is equivalent to that of being able to carve 1 billion characters on rice grains. "Yin Zhiyao said so.

   A 16nm micro logic device has 60 layers of microstructure. It needs more than more than 1000 process steps and tens of thousands of technical details to be processed. Only looking at the key step of plasma etching, its processing scale is one fifth of that of ordinary human hair, and its processing accuracy and repeatability should reach one fifth of that of ordinary human hair.

      At the beginning of IC chip medium etching equipment, the company launched 65nm plasma medium etching machine products. With the progress of technology, it has been 45nm, 32nm, 28nm and so on. Now 16nm etching machine products have been running on the customer's production line. 

     It is understood that in the past nine months, the delivery volume of medium and micro reaction platforms has exceeded 400; the single reaction platform plasma etching equipment has been delivered to the leading memory manufacturer in South Korea; the development of double reaction platform media etching and degumming integrated machine has been successful, which is the first time in the industry to integrate the double reaction platform media plasma etching and photoresisting reaction cavity on the same platform. 

    Perhaps it is because of the rapid development of China and micro enterprises in the field of semiconductor equipment that the intellectual property litigation initiated by two foreign competitors has also attracted. However, with excellent independent technology patents, China and micro enterprises have won successive victories. 

   Around 2008, when Zhengzhong micro company developed its own 12 inch chip etcher and was ready to enter the world-class chip production line, two international giant chip equipment companies came to visit. 

   In 2007, Zhongwei was sued for infringement by the industry giant applied materials company in the United States, but the evidence was still weak. Zhongwei seized the opportunity to counterclaim against the other party's unfair competition in time. The applied materials company obviously had insufficient preparation for this situation, and finally had to withdraw the claim for sum.       In 2009, another giant, Colin R & D of the United States, sued in Taiwan for micro infringement of its invention patents. As a result of the early warning analysis and preparation of intellectual property rights of micro and medium-sized semiconductors, within less than a month, the company decided to "take offense as guard", submitted a lot of evidence to the court, and adopted the "bottom-up" approach, claiming that two patents of Colin were invalid 。 At the same time, the enterprise also claims to Taiwan intellectual property bureau that the patent of Colin company is invalid. 

  On September 8, 2009, the first trial of Taiwan intellectual property court ruled that the patent of Colin company was invalid. Meso and micro semiconductors soon received orders from TSMC. Since then, the company has won the second instance of the appeal. In the confrontation between Taiwan's Intellectual Property Office, with sufficient evidence, the focus ring configuration patent of Colin was declared invalid in 2011, and the seal ring patent was also declared invalid, removing the intellectual property barriers for products to enter the Taiwan market. 

  Now, the company is developing five nanometer chip manufacturing equipment to break the German American monopoly. This technology requires the uniformity of the chip to reach 0.5 nm, equivalent to the atomic level. At present, the most advanced chip in the world is 10 nanometers, while the latest chips that can be mass produced in China are still 40 nanometers and 28 nanometers, which is 3 generations lower than the most advanced level in the world. In this highly competitive industry, whoever can lead in technology can occupy the market. 

  The most advanced 14 nm products such as Intel, TSMC and Samsung have been produced. With the listing of Apple a11 and Huawei Qilin 970 chips, TSMC is the first to enter the mature production period. 

  In April this year, Yin Zhiyao's China micro semiconductor company announced that it has mastered 5-nanometer technology and is expected to officially finalize the 5-nanometer etching machine by the end of the year. Coincidentally, two weeks later, IBM also announced its mastery of 5 nanotechnology. Therefore, Yin Zhiyao's announcement means that China and micro have broken through the monopoly of foreign enterprises in core technology, and China's semiconductor technology has occupied the highest point for the first time.

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相關標簽:等離子刻蝕機

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