Name: Suzhou cycas Microelectronics Co., Ltd.
Address: 1st floor,B06 building,No.2,Fuxing Road,Zhangjiagang Economic Development Zone,Jiangsu Province 215600PRC
在幹法等離子去膠技術中，氧是首要腐蝕氣體。它在真空等離子去膠機反響室中受高頻及微波能量效果，電離發生氧離子、遊離態氧原子 O*、氧分子和電子等混合的等離子體，其間具有強氧化才能的遊離態氧原子 （約占 10-20%）在高頻電壓效果下與光刻膠膜反響： O2→O*+ O*， CxHy + O*→CO2↑+ H2O↑。反應後生成的 CO2 和 H2O，隨即被抽走。
將待去膠片插入石英舟並平行氣流方向，推入真空室兩電極間，抽真空到 1.3Pa，通入恰當氧氣，堅持反響室壓力在 1.3-13Pa，加高頻功率，在電極間發生淡紫色輝光放電，經過調理功率、流量等技術參數，可得不一樣去膠速率，當膠膜去淨時，輝光不見。
頻率挑選：頻率越高，氧越易電離構成等離子體。頻率太高，以致電子振幅比其平均自由程還短，則電子與氣體分子磕碰概率反而減少，使電離率降低。通常常用頻率為 13.56MHz及2.45GHZ 。
Principle and application of plasma dry Resist Asher
1) reaction mechanism of plasma degumming: oxygen is the primary corrosive gas in dry plasma degumming technology.
It receives high frequency and microwave energy effect in the reaction chamber of vacuum plasma degummer, ionizes and produces a plasma mixed with oxygen ion, free oxygen atom o *, oxygen molecule and electron, among which the free oxygen atom with strong oxidation ability (about 10-20%) reacts with photoresist film under high frequency voltage effect: O2 → o * + O *, CxHy + O * → CO2 ↑ + H2O ↑. After reaction, CO2 and H2O are extracted.
2) Operation method of Resist Asher:
Insert the film to be removed into the quartz boat and parallel to the air flow direction, push it into the space between the two electrodes of the vacuum chamber, vacuumize to 1.3pa, inject appropriate oxygen, and keep the pressure of the reaction chamber at 1.3-13pa, add high-frequency power, generate lavender glow discharge between electrodes. After adjusting technical parameters such as power, flow, etc., different degumming rate can be obtained. When the film is degummed, the glow is not seen.
3) Factors affecting plasma Resist Asher: frequency selection:
The higher the frequency is, the easier oxygen is ionized to form plasma. If the frequency is too high, the amplitude of the electron is shorter than its average free path, the probability of collision between the electron and the gas molecule will be reduced, and the ionization rate will be reduced. The commonly used frequencies are 13.56MHz and 2.45GHz. Power effect: for a certain amount of gas, the power is high, the density of the active particles in the plasma is high, and the degumming speed is fast; however, when the power is increased to a certain value, the active ions consumed by the reaction are full, and the degumming speed is not significantly increased with the power. Because of the high power and substrate temperature, the power should be adjusted according to the technical requirements. Selection of vacuum degree: if the vacuum degree is improved properly, the average free path of electron motion will be enlarged, so the energy obtained from the electric field will be larger, which is favorable for ionization. In addition, when the oxygen flow must be constant, the higher the vacuum degree is, the larger the relative share of oxygen will be and the concentration of active particles will be. However, if the vacuum is too high, the concentration of active particles will decrease. The influence of oxygen flow rate: large oxygen flow rate, high density of active particles, accelerated degumming rate; but too large flow rate, the ion recombination probability increases, the average free path of electron motion shortens, and the ionization intensity decreases. If the pressure of the reaction chamber is constant and the flow rate increases, the amount of gas pumped out will be added, and the amount of active particles that have not participated in the reaction will also be added, so the effect of flow rate addition on the degumming rate is not significant.