Name: Suzhou cycas Microelectronics Co., Ltd.
Address: 1st floor,B06 building,No.2,Fuxing Road,Zhangjiagang Economic Development Zone,Jiangsu Province 215600PRC
In general, magnetron sputtering needs to be carried out in a fixed vacuum state (0.5pa), and the gas is inert gas. For the whole sputtering environment of imported equipment, such as air pressure, gas flow, magnetic field, electric control feedback, etc., evaporation series winding coating equipment is mainly used for vacuum evaporation of metal film on the surface of plastic, cloth, paper, metal foil and other ribbon materials. Products are widely used in packaging, printing, anti-counterfeiting, textile, electronic industry and other fields. This series of magnetron sputtering equipment has the characteristics of stable operation, even film, short production cycle, low energy consumption, convenient operation and maintenance, stable performance, etc., so there is a certain space for evaporation coating.
Vacuum sputtering is the abbreviation of vacuum sputtering coating, which is a kind of physical coating method.
Vacuum coating mainly refers to a kind of coating that needs to be carried out in a higher vacuum degree, including many kinds, including vacuum ion evaporation, magnetron sputtering, MBE molecular beam epitaxy, PLD laser splash deposition and so on. The main idea is divided into evaporation and sputtering.
The substrate that needs to be coated is called substrate, and the material that needs to be coated is called target. The substrate and target are in the same vacuum cavity.
In general, evaporation coating heats the target to evaporate the surface components in the form of atomic groups or ions, and settles on the substrate surface, forming the film through the film forming process (scattered island structure stray structure layer growth).
For sputtering type coating, it can be simply understood that the target is bombarded with electrons or high-energy laser, and the surface components are sputtered out in the form of atomic clusters or ions, and finally deposited on the substrate surface, going through the film-forming process, and finally forming the film.