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Magnetron sputtering (磁控濺射台))

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Why cant sputter coating completely replace thermal evaporation coating?濺射鍍膜為什麽不能完全取代熱蒸發鍍膜?

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Why cant sputter coating completely replace thermal evaporation coating?濺射鍍膜為什麽不能完全取代熱蒸發鍍膜?

發布日期:2018-08-11 作者:www.tonertimes.com 點擊:

一般磁控濺射需要在固定的真空狀態下進行(0.5Pa),氣體為惰性氣體。進口設備對於整個濺射鍍膜的環境比如氣壓、氣體流量、磁場、電控反饋等,蒸發係列卷繞鍍膜設備主要用於在塑料、布、紙、金屬箔等帶狀材料表麵真空蒸鍍金屬膜。產品廣泛用於包裝、印刷、防偽、紡織、電子工業等領域。本係列磁控濺射台設備具有運行平穩、收放鍍膜平齊、膜層均勻、生產周期短、能耗低、操作維護方便、性能穩定等特點所以蒸發鍍膜有一定的空間。

真空濺鍍,是真空濺射鍍膜的簡稱,是一種物理鍍膜的方法.

真空鍍膜主要指一類需要在較高真空度下進行的鍍膜,具體包括很多種類,包括真空離子蒸發,磁控濺射,MBE分子束外延,PLD激光濺射沉積等很多種。主要思路是分成蒸發和濺射兩種。

需要鍍膜的被稱為基片,鍍的材料被成為靶材。 基片與靶材同在真空腔中。

蒸發鍍膜一般是加熱靶材使表麵組分以原子團或離子形式被蒸發出來,並且沉降在基片表麵,通過成膜過程(散點-島狀結構-迷走結構-層狀生長)形成薄膜。

對於濺射類鍍膜,可以簡單理解為利用電子或高能激光轟擊靶材,並使表麵組分以原子團或離子形式被濺射出來,並且Z終沉積在基片表麵,經曆成膜過程,Z終形成薄膜。

In general, magnetron sputtering needs to be carried out in a fixed vacuum state (0.5pa), and the gas is inert gas. For the whole sputtering environment of imported equipment, such as air pressure, gas flow, magnetic field, electric control feedback, etc., evaporation series winding coating equipment is mainly used for vacuum evaporation of metal film on the surface of plastic, cloth, paper, metal foil and other ribbon materials. Products are widely used in packaging, printing, anti-counterfeiting, textile, electronic industry and other fields. This series of magnetron sputtering equipment has the characteristics of stable operation, even film, short production cycle, low energy consumption, convenient operation and maintenance, stable performance, etc., so there is a certain space for evaporation coating.

Vacuum sputtering is the abbreviation of vacuum sputtering coating, which is a kind of physical coating method. 

Vacuum coating mainly refers to a kind of coating that needs to be carried out in a higher vacuum degree, including many kinds, including vacuum ion evaporation, magnetron sputtering, MBE molecular beam epitaxy, PLD laser splash deposition and so on. The main idea is divided into evaporation and sputtering.

The substrate that needs to be coated is called substrate, and the material that needs to be coated is called target. The substrate and target are in the same vacuum cavity.

In general, evaporation coating heats the target to evaporate the surface components in the form of atomic groups or ions, and settles on the substrate surface, forming the film through the film forming process (scattered island structure stray structure layer growth).

For sputtering type coating, it can be simply understood that the target is bombarded with electrons or high-energy laser, and the surface components are sputtered out in the form of atomic clusters or ions, and finally deposited on the substrate surface, going through the film-forming process, and finally forming the film.

磁控濺射台

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