Name: Suzhou cycas Microelectronics Co., Ltd.
Address: 1st floor,B06 building,No.2,Fuxing Road,Zhangjiagang Economic Development Zone,Jiangsu Province 215600PRC
RIE plasma etcher is a common form of Zui in dry etching. Its principle is that the gas exposed to the electronic area forms plasma, which produces ionized gas and releases gas composed of high-energy electrons, thus forming plasma or ion. When the ionized gas atom is accelerated by electric field, it will release enough force to tightly bond the material or etching table with the surface expulsion force Noodles. To some extent, plasma cleaning is actually a slight case of plasma etching. Equipment for dry etching process includes reaction chamber, power supply and vacuum part. The workpiece is sent to the reaction chamber which is evacuated by the vacuum pump. The gas is introduced and exchanged with the plasma. The plasma reacts on the surface of the workpiece, and the volatile by-products are pumped away by vacuum pump. Plasma etching is actually a reactive plasma process.
Processing mode with RIE plasma etching machine:
direct mode - the substrate can be directly placed on the electrode bracket or the base bracket, so as to obtain the large plane etching effect of Zui.
Orientation mode - substrate requiring anisotropic etching can be placed on a special plane bracket.
Downstream mode - the substrate can be placed on an uncharged bracket to achieve a small plasma effect.
Custom mode - when the planar etching configuration is not ideal, a special electrode configuration can be provided.
The disadvantages of wet etching compared with RIE plasma etching machine are:
The silicon wafer runs horizontally, with high chip height (plasma etching to PSG bath soaking and drying, and the silicon wafer has little impact);
The silicon wafer is easy to be polluted by the blanking pen (plasma etching to PSG and then drying);
The transmission roll drawing is easy to deform (PVDF, PP material and placed horizontally);
High cost (the cost of chemical etching instead of plasma etching increases). In addition, some plasma etchers, such as SCE plasma etchers, also have "green"advantages: no CFC and sewage, safe operation and environment, toxic and corrosive liquids are eliminated.
With RIE plasma etcher inspection operation and judgment
Confirm that the multimeter works normally, and the range is set at 200mV.
The cold probe is connected to the positive electrode of the voltmeter, and the hot probe is connected to the negative electrode of the voltmeter.
Use cold and hot probes to contact two points on one edge of the silicon wafer that are not connected. The voltmeter shows that the voltage between the two points is positive, indicating that the conductive type is p-type, and the etching is qualified. The same method is used to detect whether the conductive type of the other three edges is p-type.
If any edge is not etched as qualified after inspection, this batch of silicon wafers need to be reloaded for etching.