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等離子幹法去膠機反應機理:Reaction mechanism of plasma dry degumming machine:

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等離子幹法去膠機反應機理:Reaction mechanism of plasma dry degumming machine:

發布日期:2019-03-16 作者:www.tonertimes.com 點擊:

1) 等離子幹法去膠機反應機理:

   在幹法等離子去膠技術中,氧是首要腐蝕氣體。它在真空等離子去膠機反響室中受高頻及微波能量效果,電離發生氧離子、遊離態氧原子 O*、氧分子和電子等混合的等離子體,其間具有強氧化才能的遊離態氧原子 (約占 10-20%)在高頻電壓效果下與光刻膠膜反響: O2→O*+ O*, CxHy + O*→CO2↑+ H2O↑。反應後生成的 CO2 和 H2O,隨即被抽走。

幹法去膠機

2) 等離子去膠操作方法:

   將待去膠片插入石英舟並平行氣流方向,推入真空室兩電極間,抽真空到 1.3Pa,通入恰當氧氣,堅持反響室壓力在 1.3-13Pa,加高頻功率,在電極間發生淡紫色輝光放電,經過調理功率、流量等技術參數,可得不一樣去膠速率,當膠膜去淨時,輝光不見。

3)等離子去膠影響要素:

   頻率挑選:頻率越高,氧越易電離構成等離子體。頻率太高,以致電子振幅比其平均自由程還短,則電子與氣體分子磕碰概率反而減少,使電離率降低。通常常用頻率為 13.56MHz及2.45GHZ 。

   功率影響:關於必定量的氣體,功率大,等離子體中的的活性粒子密度也大,去膠速度也快;但當功率增大到必定值,反響所能耗費的活性離子到達飽滿,功率再大,去膠速度則無顯著添加。由於功率大,基片溫度高,所以應根據技術需求調理功率。

   真空度的挑選:恰當進步真空度,可使電子運動的平均自由程變大,因而從電場取得的能量就大,有利電離。別的當氧氣流量必守時,真空度越高,則氧的相對份額就大,發生的活性粒子濃度也就大。但若真空度過高,活性粒子濃度反而會減小。

氧氣流量的影響:氧氣流量大,活性粒子密度大,去膠速率加速;但流量太大,則離子的複合概率增大,電子運動的平均自由程縮短,電離強度反而降低。若反響室壓力不變,流量增大,則被抽出的氣體量也添加,其間尚沒參與反響的活性粒子抽出量也隨之添加, 因而流量添加對去膠速率的影響也就不甚顯著。

     1) Reaction mechanism of plasma dry degumming machine: 

         In dry plasma degumming technology, oxygen is the primary corrosive gas. It receives high frequency and microwave energy effect in the reaction chamber of vacuum plasma degummer, ionizes and produces plasma mixed with oxygen ion, free oxygen atom o *, oxygen molecule and electron, among which free oxygen atom with strong oxidation ability (about 10-20%) reacts with photoresist film under high frequency voltage effect: O2 → o * + O *, CxHy + O * → CO2 ↑ + H2O ↑. After reaction, CO2 and H2O are extracted.

    2) Operation method of plasma degumming: 

        Insert the film to be removed into the quartz boat and parallel to the air flow direction, push it into the space between the two electrodes of the vacuum chamber, vacuumize to 1.3pa, inject appropriate oxygen, and keep the pressure of the reaction chamber at 1.3-13pa, add high-frequency power, generate lavender glow discharge between electrodes. After adjusting technical parameters such as power, flow, etc., different degumming rate can be obtained. When the film is degummed, the glow is not seen. 

    3) Factors affecting plasma degumming: 

        Frequency selection: the higher the frequency is, the easier oxygen is ionized to form plasma. If the frequency is too high, the amplitude of the electron is shorter than its average free path, the probability of collision between the electron and the gas molecule will be reduced, and the ionization rate will be reduced. The commonly used frequencies are 13.56MHz and 2.45GHz.               Power effect: for a certain amount of gas, the power is high, the density of the active particles in the plasma is also high, and the degumming speed is fast; but when the power is increased to a certain value, the active ions consumed by the reaction will be full, and the degumming speed will not be significantly increased if the power is higher. Because of the high power and substrate temperature, the power should be adjusted according to the technical requirements. 

      Selection of vacuum degree: if the vacuum degree is improved properly, the average free path of electron motion will be enlarged, so the energy obtained from the electric field will be larger, which is favorable for ionization. In addition, when the oxygen flow must be constant, the higher the vacuum degree is, the larger the relative share of oxygen will be and the concentration of active particles will be. However, if the vacuum is too high, the concentration of active particles will decrease. 

     The influence of oxygen flow rate: large oxygen flow rate, high density of active particles, accelerated degumming rate; but too large flow rate, the ion recombination probability increases, the average free path of electron motion shortens, and the ionization intensity decreases. If the pressure of the reaction chamber is constant and the flow rate increases, the amount of gas pumped out will be added, and the amount of active particles that have not participated in the reaction will also be added, so the effect of flow rate addition on the degumming rate is not significant.

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相關標簽:幹法去膠機

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