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微波等離子幹法去膠機影響因素:Influencing factors of microwave plasma dry degumming machine:

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微波等離子幹法去膠機影響因素:Influencing factors of microwave plasma dry degumming machine:

發布日期:2019-08-17 作者:www.tonertimes.com 點擊:

微波等離子幹法去膠機影響因素:

幹法去膠機

  頻率選擇:頻率越高,氧越易電離形成等離子體。頻率太高,以至電子振幅比其平均自由程還短,則電子與氣體分子碰撞幾率反而減少,使電離率降低。一般常用頻率為 13.56MHz及2.45GHZ 。

  功率影響:對於一定量的氣體,功率大,等離子體中的的活性粒子密度也大,去膠速度也快;但當功率增大到一定值,反應所能消耗的活性離子達到飽和,功率再大,去膠速度則無明顯增加。由於功率大,基片溫度高,所以應根據工藝需要調節功率。

  真空度的選擇:適當提高真空度,可使電子運動的平均自由程變大,因而從電場獲得的能量就大,有利電離。另外當氧氣流量一定時,真空度越高,則氧的相對比例就大,產生的活性粒子濃度也就大。但若真空度過高,活性粒子濃度反而會減小。

  氧氣流量的影響:氧氣流量大,活性粒子密度大,去膠速率加快;但流量太大,則離子的複合幾率增大,電子運動的平均自由程縮短,電離強度反而下降。微波等離子去膠機若反應室壓力不變,流量增大,則被抽出的氣體量也增加,其中尚沒參加反應的活性粒子抽出量也隨之增加, 因此流量增加對去膠速率的影響也就不甚明顯。

Influencing factors of microwave plasma dry degumming machine:

    Frequency selection: the higher the frequency is, the easier oxygen is ionized to form plasma. If the frequency is so high that the amplitude of the electron is shorter than its average free path, the probability of collision between the electron and the gas molecule will be reduced, and the ionization rate will be reduced. Generally, the commonly used frequencies are 13.56MHz and 2.45GHz.

   Power effect: for a certain amount of gas, the power is high, the density of the active particles in the plasma is high, and the degumming speed is fast; however, when the power increases to a certain value, the active ions consumed by the reaction reach saturation, and the degumming speed does not increase significantly when the power is higher. Because of the high power and substrate temperature, the power should be adjusted according to the process requirements.

  Selection of vacuum degree: if the vacuum degree is properly increased, the average free path of electron motion will be enlarged, so the energy obtained from the electric field will be larger, which is favorable for ionization. In addition, when the oxygen flow rate is constant, the higher the vacuum degree is, the larger the relative proportion of oxygen is, and the greater the concentration of active particles is. However, if the vacuum is too high, the concentration of active particles will decrease.

  The influence of oxygen flow rate: large oxygen flow rate, high density of active particles, faster degumming rate; but too large flow rate, the probability of ion recombination increases, the average free path of electron motion shortens, and the ionization intensity decreases. If the pressure of the reaction chamber and the flow rate of the microwave plasma degummer are constant, the amount of gas pumped out will also increase, and the amount of active particles that have not participated in the reaction will also increase, so the effect of the flow rate increase on the degumming rate is not obvious.


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相關標簽:幹法去膠機

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