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EVG Gemini Automated production Wafer Bond

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EVG Gemini Automated production Wafer Bond

  • 所屬分類:黃光Lithography

  • 點擊次數:
  • 發布日期:2020/07/06
  • 在線詢價
詳細介紹

EVG Gemini Automated production configuration information:

1.Fully automated operation

2.Interlocked doors with signal light tower

3.4 Axis Industrial Robot

4.EVG CIM Framework Software GUI (Graphical User Interface)

5.Flexible process flow definition 

6.Drag and drop recipe programming 

7.Parallel processing of multiple jobs 

8.Automated recording of process and machine parameters 

9.Throughput optimized handling sequence 

10.Password protected user access levels

11.Open cassette loading with empty/present sensor 

12.Currently configured for 6" (150mm) wafers (4" and 8" optional with additional hardware) 

13.Qty 8 bond chucks included for 6" wafers, additional chucks can be offered 

14.SmartView?NT Alignment Module with 5x Objectives 

15.4 Bond modules with up to 550°C and 10kN bond force 

16.Formic Acid Bubbler option for purging formic acid vapor into bond chamber  

17.1 purge gas line for process gas 

18.CE Certified

19.All system documentation


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